「Silicon Dies are being Attached to Substrate by Pick and Place Machine on Semiconductor Factory. Computer Chip Manufacturing at Fab. Packaging Process.」によく似た画像、写真素材、ベクター画像 - 2259453351 | Shutterstock

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Silicon Dies are being Attached to Substrate by Pick and Place Machine on Semiconductor Factory. Computer Chip Manufacturing at Fab. Packaging Process.

ロイヤリティフリー写真素材ID: 2259453351

Silicon Dies are being Attached to Substrate by Pick and Place Machine on Semiconductor Factory. Computer Chip Manufacturing at Fab. Packaging Process.（一致 100）

寄稿者: IM Imagery

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