Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Semiconductor Packaging Process. (100 correspondências)
Por IM Imagery
Nossa empresa
Vídeos e fotos stock
Vídeos e fotos stock
Parceiros
Jurídico
Jurídico
Nossas marcas
Nossas marcas
Inovação