Conectează-te
Clipuri video similare
ID fotografie de stoc fără drepturi de autor: 2262331365

Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Semiconductor Packaging Process. (82 potriviri)

IM IMAGERY

© 2003-2024 Shutterstock, Inc.